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CWA stone

Polishing Stones Polishing Stones

For both dry and wet type. Also suitable for cutter mark removal and press dies.

■Use
Surface polishing after EDM and removing cutting marks for pressed mold.
■Performance
This stone shows sharp cutting ability with using octahedron monocrystal WA grains. It is a best stone for removing cutting marks and can be used both in wet and dry conditions.
■Abrasive
WA
■Hardness
Medium Soft
■Binder
V
■Quantity
20
■Particle size
#80 #120 #150 #180 #220
■Main size
3x6x100 3x6x150 3x13x150 10x25x150
K.K.3-A SANGYO
〒130-0021
3-21-6, Midori, Sumida-ku, Tokyo
TEL. 03-3635-5151
FAX. 03-3635-5150
Industrial products and technical import and export duties, sale duties
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